Compeed ampoule talon escarpin 5 pansements
  • Compeed ampoule talon escarpin 5 pansements

COMPEED Escarpin Heel Blister - 5 Dressings

Compeed® Heel - Shoe Blister dressings provide instant pain relief and help speed up the healing process.

Prix : €7.99
Tax included
En stock Available for delivery and collection

3574661047720

Compeed® Heel - Shoe Blister dressings with their advanced hydrocolloid technology provide instant pain relief and help accelerate the healing process. The unique butterfly-shaped design with translucent edges is designed to position and adapt perfectly and discreetly to the heel at Achilles tendon level. These ultra-discreet dressings are suitable for all blisters, whether caused by wearing high heels or low street shoes.

All our blister dressings feature Compeed® hydrocolloid technology; an active gel with moisture-absorbing particles, creating a favorable environment for rapid healing. Moisture absorption by the hydrocolloid particles reinforces the dressing's cushioning effect, redistributing pressure and providing instant pain relief. The Compeed® Ampoules -Escarpin dressing has a bevelled edge that hugs the surface of the skin perfectly. This ensures good adhesion of the dressing to the skin, reduces friction, and holding the dressing in place guarantees an optimal healing process and the absence of painful rubbing.

*The dressing remains in place for 24 hours. The length of time may vary according to the individual.

Specific References

  1. Clean and dry the skin before use, ensuring that the area is free of cream and oil.
  2. Remove the protective paper, taking care not to touch the adhesive side of the dressing.
  3. Apply the dressing firmly to the blister, making sure the edges are smooth.
  4. Leave in place until it begins to detach on its own.
  5. To remove, do not pull the dressing upwards, but stretch it slowly along the skin.

Hydrocolloid layer covered on the outside with a semi-permeable polyurethane film.

Diabetics, infected wounds, deep wounds, bleeding wounds.